reduce solder stop opening sizes for pads of U2, U3, U4 and U7
The solderstop openings overlap for the RAM IC, so there are no ligament between - I'm fine with that for a 0,8mm pitch IC.
But let's reintroduce something that has been better in the former design than now: for QFP packages, please reduce the size of the pads' solder mask openings for U2, U4 and U7.
Their pads are (here: FPGA) 0,3, and gap 0,2mm. PCB house would always remove solder stop overlaps on solder pads anyways, so you can use the minimum distance pad copper-solder stop of 0,03mm. If you use this, the remaining segment would be 0,14mm which is about twice the allowed minimum of 0,075mm.