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Bug #5109

closed

reduce solder stop opening sizes for pads of U2, U3, U4 and U7

Added by mschramm about 3 years ago. Updated almost 3 years ago.

Status:
Resolved
Priority:
Normal
Assignee:
cibomahto
Category:
electronics
Target version:
3.4
Start date:
Due date:
% Done:

100%

Description

The solderstop openings overlap for the RAM IC, so there are no ligament between - I'm fine with that for a 0,8mm pitch IC.

But let's reintroduce something that has been better in the former design than now: for QFP packages, please reduce the size of the pads' solder mask openings for U2, U4 and U7.

Their pads are (here: FPGA) 0,3, and gap 0,2mm. PCB house would always remove solder stop overlaps on solder pads anyways, so you can use the minimum distance pad copper-solder stop of 0,03mm. If you use this, the remaining segment would be 0,14mm which is about twice the allowed minimum of 0,075mm.

Files

solderstop-FTDI.jpg View solderstop-FTDI.jpg 78.5 KB mschramm, 04/09/2021 01:56 PM
solderstop-FPGA.jpg View solderstop-FPGA.jpg 79.5 KB mschramm, 04/09/2021 01:56 PM
solderstop-RAM.jpg View solderstop-RAM.jpg 82.9 KB mschramm, 04/09/2021 01:56 PM
solder mask expansion rule.png View solder mask expansion rule.png 26.5 KB cibomahto, 04/09/2021 09:41 PM
solder mask gap.png View solder mask gap.png 55.8 KB cibomahto, 04/09/2021 09:41 PM
after.jpg View after.jpg 162 KB cibomahto, 05/22/2021 06:31 PM
track removed.jpg View track removed.jpg 780 KB cibomahto, 05/22/2021 06:31 PM
updated soldermask rule.jpg View updated soldermask rule.jpg 149 KB cibomahto, 05/22/2021 06:31 PM
track on U3.jpg View track on U3.jpg 774 KB cibomahto, 05/22/2021 06:31 PM
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