Hardware » History » Revision 4
Revision 3 (laforge, 05/02/2017 08:54 PM) → Revision 4/22 (laforge, 05/02/2017 09:05 PM)
h1. Hardware
h2. Physical Setup / Board Stacking
The hardware consists of two circuit boards:
* Top board: AC/DC power supply and Ethernet switch
* Bottom board: Actual Femtocell mainboard
The two boards are sandwiched together by the following connections:
* 6-pin fine-pitch connector (most likely for DC power)
* flexible printed circuit cable (most likely for Ethernet MII/RMII)
* two large sheet metal parts for ground and/or thermal connection
It is thus not very straight forward to operate the opened device in a safe way (i.e. without live AC line voltage present).
We will be working on a way to operate it with injected safe low DC voltage, but that is still TBD.
h2. Major Components
h3. Femtocell SoC
Broadcomm BCM61610KFB1G (formerly Percello)
* no information found anywhere
h3. NAND Flash
Hynix H27U1G8F2BTR
* 1Gbit (128MByte) NAND Flash, x8 data bus, 3.3V, 2k page size, 128k erase block, 48pin TSOP1
* http://natisbad.org/NAS/refs/Hynix_NAND_128Mo_H27U1G8F2BT.pdf
h2. RF Transceiver
Maxim MAX2550
* Band I, V, and VIII WCDMA Femtocell Transceiver with GSM Monitoring
* https://www.maximintegrated.com/en/products/comms/wireless-rf/MAX2550.html
* https://datasheets.maximintegrated.com/en/ds/MAX2550.pdf
* https://www.maximintegrated.com/en/app-notes/index.mvp/id/5364