Hardware Projects » OpenVizsla USB tracer/analyzer

Should this apply to the small component pads as well? My concern would be that increasing the conductor width on the 0402 components might result in them being unbalanced thermally.

I see three options here:
1. Increase all thermal connects, say from the original 0.254mm gap/0.254mm conductor spec to 0.381mm gap/0.508mm conductor (as pictured)
2. Make a new rule, and only apply it to larger pads (such as the one in the example)

on another topic (#5066):

to modify this for at least some of the top-and-bottom layer pads

yes. I think we should minimize efforts here. - Thanks for your explanation in #5066. The thermals look good for traces like the ones you pictures in #5066#note-3 for parts like e.g. 0402. We can boil down our concerns to those ones like the four GND pads close to the mounting holes and especially the ones on the SMA footprints. Let's only change those ones mentioned, from 0,254mm trace width to 0,508mm (top and bott).

Implemented here: https://github.com/openvizsla/ov_ftdi/pull/46/commits/0067bd55dc7637188a5d1bcd3c35602e1a6e9866

Rule added to change the thermals on just those footprints.

solved; thanks!